The sales and technical team of Kunshan Lewei Electronics recently took part in a renowned international semiconductor material exhibition, showcasing our complete product portfolio covering 2–12 inch polished wafers, thermal oxide wafers and multilayer SOI wafers for global professional buyers spanning chip manufacturing, academic research and semiconductor distribution sectors. Our booth arranged physical wafer samples, process specification brochures and finished application case displays, helping overseas visitors intuitively understand our production precision and customized manufacturing capacity.
Throughout the exhibition, our engineers carried out in-depth technical exchanges with wafer distributors, MEMS sensor manufacturers, power semiconductor enterprises and academic research institutions coming from Europe, Southeast Asia and North America. A large share of visitors expressed strong interest in our flexible customization capabilities, which support adjustable wafer dimensions, customizable oxide layer thickness and tailored doping specifications to match unique project requirements. Multiple clients shared their long-standing procurement frustrations: large mainstream wafer manufacturers enforce rigid high minimum order quantities and are unwilling to accommodate small-batch custom development for prototype testing; Lewei’s lean, adaptable production model perfectly fills this long-existing market gap for low-volume custom wafer demands.
