A mid-sized European MEMS sensor manufacturer intended to roll out its new lineup of industrial pressure sensors built for harsh factory automation scenarios. The new product demanded custom SOI wafers with highly customized thickness for both the device layer and buried oxide layer to satisfy strict anti-interference, high-temperature operating criteria. Large global wafer manufacturers declined this project for two core reasons: the initial trial order volume was too low to meet their mass production thresholds, and building dedicated manufacturing workflows for highly customized parameters would create excessive operational overhead. Unable to find a qualified supplier across mainstream channels, the client reached out to Lewei for tailored technical solutions.
Once we received the client’s full set of technical specifications, our internal R&D team finished process architecture design within just one week. We then scheduled precision manufacturing inside our class-grade cleanroom, strictly controlling wafer bonding, layer etching and polishing procedures to deliver certified SOI wafer samples right on schedule. Our engineering team also offered remote technical guidance covering wafer characterization, chip fabrication process tuning and yield optimization throughout the client’s prototype testing phase. All sample batches smoothly passed the client’s full suite of reliability assessments including thermal cycling, pressure fatigue and long-term electrical stability testing.
