Kunshan Lewei Electronics has officially completed the upgrade of its core grade cleanroom built for silicon wafer manufacturing, following three months of targeted facility reconstruction, infrastructure optimization and precision equipment commissioning. This upgraded production zone supports three core product lines: single-sided & double-sided polished silicon wafers, thermal oxidation SiO₂ coated wafers, and custom engineered SOI wafers, covering mainstream custom wafer demands from laboratory research to industrial chip mass production.
During this facility upgrade, we deployed multiple advanced sets of precision grinding modules, chemical mechanical polishing systems and thermal oxidation furnaces. The revamped production workflow can regulate wafer surface roughness to ultra-tight tolerance ranges, while delivering outstanding thickness uniformity for buried oxide layers inside SOI wafers. The refined operational logic cuts sample manufacturing lead time for custom orders by roughly 22%, and significantly raises the maximum monthly bulk wafer output we can ship to overseas commercial clients. Shorter lead times and larger production capacity allow us to better accommodate tight project schedules for global research institutes and chip enterprises.
