3

Silicon Single Crystal Ingot

Polysilicon is grown into rod-shaped monocrystalline silicon ingots via the Czochralski (CZ) method or Float-Zone (FZ) method

Growth Technology
Czochralski (CZ) method/Float Zone (FZ) method
Available Diameters
2 inch; 3 inch; 4 inch; 5 inch; 6 inch; 8 inch; 12 inch; 18 inch
Market Mainstream Sizes
8 inch; 12 inch

Describe Details

Rod-shaped monocrystalline silicon materials are produced by growing crystals from polysilicon via the Czochralski (CZ) method or Float-Zone (FZ) method. The term "silicon rod" generally refers to monocrystalline silicon ingots. If the rod features a polycrystalline structure, it is normally called a polysilicon chunk.

Monocrystalline silicon ingots are categorized by diameter into 2-inch, 3-inch, 4-inch, 5-inch, 6-inch, 8-inch, 12-inch and 18-inch specifications. At present, 8-inch and 12-inch ingots dominate the market.
As the raw material for silicon wafer manufacturing, monocrystalline silicon ingots exert a direct impact on wafer quality in terms of overall quality and intrinsic defect density. Parameters including carbon and oxygen concentrations, resistivity uniformity and internal defect levels of silicon wafers are all determined during the crystal growth process of silicon ingots.

Crystal growth technology thus ranks among the core key technologies for semiconductor materials. Only a handful of major enterprises have mastered crystal growth technologies for ingots exceeding 12 inches, and China is still in the catch-up phase in this field.

Parameter Category Specifications
Definition Rod-shaped monocrystalline silicon material produced by growing polycrystalline silicon via Czochralski (CZ) or Float Zone (FZ) method
Growth Technology Czochralski (CZ) method, Float Zone (FZ) method
Available Diameters 2 inch, 3 inch, 4 inch, 5 inch, 6 inch, 8 inch, 12 inch, 18 inch
Market Mainstream Sizes 8 inch, 12 inch
Core Quality Determinants Carbon content, oxygen content, resistivity uniformity, internal crystal defects — all determined during the crystal growth process
Primary Application Upstream raw material for silicon wafer manufacturing; ingot quality directly determines final wafer quality
Industry Technology Note Crystal growth is one of the core key technologies for semiconductor materials. Large-size (12-inch and above) crystal growth technology is mastered by only a handful of major global manufacturers, with China still in the catch-up stage

FAQ

Can I obtain samples?

Yes.

Can I use my own logo or design on the product?

Yes, we can label the products according to your requirements. Both internal and external labels are acceptable.

Do you have a factory?

Yes, we have a factory in Jiangsu. Welcome to visit our company and factory.

What is the production capacity of your factory?

Our main focus is on the product process and production cycle.

When will the shipment be made?

Based on your needs, we will arrange for same day shipment for items in stock, and for items out of stock, we will check the delivery date. Delivery will be made within the delivery time.