2-8 Inch Prime Grade Polished Silicon Wafer CZ/FZ Single Crystal

Our polished silicon wafer represents the flagship product in our semiconductor substrate portfolio, manufactured to the highest precision standards for integrated circuit and MEMS device fabrication. Each polished silicon wafer undergoes a rigorous multi-stage production process including crystal growth, inner diameter slicing, edge rounding, lapping, chemical etching, and final chemical mechanical polishing (CMP) to achieve an ultra-smooth, damage-free surface with atomic-level flatness. We maintain strict cleanroom conditions throughout the entire polishing and inspection process to ensure minimal particle contamination on every polished silicon wafer we deliver.

We offer polished silicon wafers in diameters ranging from 2 inches to 8 inches, produced from both Czochralski (CZ) and Float Zone (FZ) single crystal ingots to suit different application requirements. CZ polished silicon wafers provide excellent cost efficiency and uniform oxygen content for general IC and MEMS applications, while FZ polished silicon wafers deliver ultra-high purity and higher resistivity for power semiconductor and high-voltage device manufacturing. Our product range covers N-type and P-type doping across various resistivity grades, with crystal orientation options including <100>, <110>, and <111> to match specific device design requirements. We also provide both single-side and double-side polished options depending on customer process needs.

Every polished silicon wafer is subjected to comprehensive quality inspection including total thickness variation (TTV) measurement, warp and bow testing, surface particle counting using laser scanning systems, resistivity mapping, and crystal defect analysis through preferential etching to ensure consistent performance across the entire wafer surface. Available in Prime, Test, and Dummy quality grades, our polished silicon wafers cater to diverse requirements from high-volume IC production lines to university research and development prototyping projects. As a trusted polished silicon wafer supplier, we maintain strict cleanroom standards throughout manufacturing and packaging, delivering substrates that meet or exceed SEMI international standards for semiconductor fabrication.

Parameter Category	Specifications
Wafer Diameter	2 inch, 3 inch, 4 inch, 5 inch, 6 inch, 8 inch (customizable)
Crystal Growth Method	Czochralski (CZ), Float Zone (FZ)
Doping Type	N-type (Phosphorus, Arsenic, Antimony doped); P-type (Boron doped)
Resistivity	0.001 Ω·cm up to >10,000 Ω·cm (high-resistivity)
Crystal Orientation	<100>, <110>, <111>
Total Thickness Variation (TTV)	≤ 0.5 μm
Warp	≤ 10 μm
Bow	≤ 5 μm
Surface Roughness (Ra)	≤ 0.5 nm (atomic-level flatness)
Quality Grade	Prime Grade (device-grade production wafer); Test Grade; Dummy Grade (monitor wafer)
Inspection	100% full inspection: particle detection, resistivity mapping, crystal defect scan
Standard Compliance	Compliant with SEMI international standards
Packaging	Class 100 cleanroom vacuum packaging; 25 pieces per box or custom quantity
Documentation	Full inspection report and material certificate included per shipment
Applications	IC manufacturing, MEMS fabrication, power semiconductors, solar cells, R&D labs

The polished silicon wafer serves as the foundational starting material for nearly all semiconductor device manufacturing processes including photolithography, thin film deposition, ion implantation, and etching. Our customers include integrated device manufacturers, MEMS foundries, solar cell producers, and university research laboratories worldwide who rely on our consistent quality and reliable supply of polished silicon wafers for their critical production and research operations. We offer flexible order quantities from small research batches to volume production supply, with comprehensive technical support and custom specification development services to help our customers achieve optimal results in their semiconductor fabrication processes. Additionally, we provide custom wafer processing services including backside metallization, wafer thinning, and dicing services to support customers with specific packaging and assembly requirements, making us a comprehensive one-stop substrate solution provider.